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datashee t product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18.apr.2016 rev.001 www.rohm.com tsz22111 ? 14 ? 001 low noise power supply lsi series for audio system ultra l ow noise low dropout regulator for audio system BD37201NUX general description BD37201NUX is a low saturation series regulator of low noise (4.72 v rms) which is most suitable to high quality audio system. it operates at 2.7 v to 5.5v and capable of supplying a maximum load of 500ma. BD37201NUX has a high psrr and good input transient fluctuation characteristic which makes it suitable for the stabilization of dc/dc converter output, and an ideal power supply to high precision analog circuits such as d/a converter (dac) or clock generator. furthermore, when BD37201NUX is placed in standby mode, the supply current can be as small as 0a(typ) which can greatly reduce power consumption. features ultra l ow noise, high psrr stable at 1f ceramic input and output capacitors standby mode that is controlled by enable pin dropout voltage: 200mv (at 500ma load) under voltage lockout protection, current limit and short circuit protection, thermal shutdown protection applications high quality audio equipment power supply for d/a converter and clock generator the other application which require low noise key specifications input voltage range: 2.7 v to 5.5v output voltage range: 1.0v to 4.5v output current: 0.5a(max) output voltage noise: 4.72 v rms(10 to 100khz) psrr: 74db(100hz), 50db(1mhz) input transient response: 5mv(1.0v/s) standby current: 0 a (typ) operating temperature range: -40c to +85c pac ka ge w(typ) x d(typ) x h(max) vson008x2030 2.00mm x 3.00mm x 0.60mm typical application circuit vin en bas bao gnd bc vo c in 1f c bc 1f c out 1f v out =3.35v r 1 120k r 2 51k vs switching regulator clock generator dac v in =5.0v figure 1. basic application circuit diagram (v out =3.35v) vson008x2030 downloaded from: http:///
2/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX pin configuration 1 2 3 4 5 6 7 8 (top view) vo vs gnd bc en bao bas vin figure 2. pin configuration pin description pin no. pin name function 1 vo output voltage 2 vs output voltage feedback 3 gnd ground 4 bc bypass capacitor pin connected to ground 5 en e nable 6 bao programmed voltage output 7 bas programmed voltage feedback 8 v in input voltage (note) the exposed pad should be connected to gnd pattern. block diagram bg en refamp error amp gnd ocp , tsd , uvlo 100k bao bas vin bc vo 7 6 5 4 3 1 8 bc charge 2 vs figure 3. block diagram downloaded from: http:///
3/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX description of block 1. enable assuming en terminal is set to l, the ic can be set to standby state. in standby state, the output is off and since it will be in static state, the power consumption can be reduced. 2. rising ,falling, and en controlled timing uvlo (internal signal) vout time 1.4v(typ) 2.30v(typ) bc uvlo release uvlo detect en off l 0v0v vin en 0v 0v 1.6v(typ) 2.45v(typ) en on 1.4v(typ) 1.6v(typ) 1.0v 1.0v 9ms 9ms en off en on vout disable (internal signal) l 85% 85% 85% 85% figure 4. the waveform during vin/en rising and falling (when at bc capacit or 1f and output 1v settings) it will operate if en is on and uvlo (under voltage lock out ) is released. in addition, when en is off or uvlo is detected, the regulator operation stops. the maximum slew rate of input voltage has to be set under 1v/s. 3. soft start function in BD37201NUX, there exists a function that limits the rising spee d of output when en rises by the capacit or connected to bc due to decrease of in rush current of output. the ris ing speed depends on the capacitance value connected to bc and on the output programmed voltage. it is about 9ms (typ) if capacitance is 1f and output programme d voltage is 1v, and almost 30ms (typ) if output programmed voltage is set to 3.35v. 4. refamp re famp settle its output voltage through the reference voltage 1.0v ( typ) and external resistors. 5. bc terminal noise at the output voltage of refamp will be reduced because of the internal resistor and the external bc capacitor. in addition to it, the external bc capacitor also has a soft start function so the rising speed can be adjust ed by this value. the higher value of capacitor will decrease the noise but t he softstart time will be longer. 6. erramp the erramp outputs the voltage set in refamp at closed gain 1 time . vs terminal must be connected to o ut by all means. in addition, vs terminal can decrease a voltage drop by the pattern resistance on the o ut course by returning the voltage from the supply point. downloaded from: http:///
4/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX absolute maximum rating (ta = 25c) parameter symbol rating unit power supply voltage v in -0.3 to + 7. 0 v terminal voltage (the other pins) v pin -0.3 to +7.0 v operating temperature range topr - 40 to +85 c storage temperature range tstg - 55 to +150 c junction temperature tjmax 150 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important t o consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = -40c to +85c) parameter symbol min typ max unit power supply voltage v in 2.7 - 5.5 v output voltage setting is within a possible range v out 1.0 - 4.5 v output current i o ut - - 0.5 (note 1) a (note 1 ) aso should not be exceeded. operating condition parameter symbol min typ max unit conditions input capacitor c in 0.47 (note 2) 1 - f ceramic capacitors are recommended output capacitor c o ut 0.22 (note 2) 1 - f ceramic capacitors are recommended bc capacitor c bc 0.01 (note 2) 1 - f ceramic capacitors are recommended (note 2) please set the capacity of the condenser not to be less than the minimum in consideration of temperature or dc bias properties. thermal resistance (note 3) parameter symbol thermal resistance (typ) unit 1s (note 5) 2s2p (note 6) vson008x2030 junction to ambient ja 30 8.3 69.6 c /w junction to top characterization parameter (note 4) jt 43 10 c /w (note 3) based on jesd51-2a(still-air) (note 4) the thermal characterization parameter to report t he difference between junction temperature and the temperatu re at the top center of the outside surface of the component package. (note 5) using a pcb board based on jesd51- 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70m (note 6) using a pcb board based on jesd51-5, 7. layer number of measurement board material board size thermal via (note 7) pitch diameter 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt 1.20mm 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70m 74.2mm (square) 35m 74.2mm (square) 70m (note 7) this thermal via connects with the copper pattern of all layers. downloaded from: http:///
5/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX electrical characteristics (unless otherwise specified, v in = v out +1.0v or 2.7 v whichever is greater v out =1.0v ta=25c c o ut =1f c bc =1f i out =5ma v in =v en ) parameter symbol min typ max unit conditions circuit current i cc - 1.33 2.3 ma - standby current i stb - 0.0 1 .0 a v in =5.5v reference voltage v ref 0.99 1.00 1.01 v bas voltage line regulation d vi - 1 20 mv v in = 2.7v to 5.5v load regulation d vl - 3 20 mv i o ut = 0 ma to 500ma dropout voltage v sat - 0. 2 0.5 v i o ut = 500ma psrr 1khz psrr 1k hz - 90 - db f= 1khz psrr 1mhz psrr 1mhz - 55 - db f= 1mhz, c o ut =47f output noise voltage v noise - 4.7 - vrms bw= 10hz to 100khz, c bc =10 f , i o ut = 500ma output current capability i ocp 5 00 - - ma - uvlo detect voltage v uvloh 2.10 2.30 2.50 v - uvlo release voltage v uvlol 2.25 2.45 2.65 v - en detecting voltage range v thenh 2.20 - v in v - en release voltage range v thenl 0.00 - 0.60 v - en input current i en - 1.23 2. 10 a v en = 3v downloaded from: http:///
6/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX application information (unless otherwise specified, v in = v out +1.0v or 2.7v whichever is greater v out =1.0v ta=25c c out =1f c bc =1f i out =5ma) figure 5. noise vs c bc figure 6. noise vs v out figure 7. noise vs i out figure 8. line regulation 0.01 0.10 1.00 10.00 10 100 1k 10k 100k 1m noise [ v/ hz ] frequency [hz] 0.01 0.10 1.00 10.00 10 100 1k 10k 100k 1m noise [ v/ hz ] frequency [hz] 0.01 0.10 1.00 10 100 1k 10k 100k 1m noise [ v/ hz ] frequency [hz] 0.980 0.985 0.990 0.995 1.000 1.005 1.010 1.015 1.020 2 3 4 5 6 v out [v] input voltage:v in [v] i out =500ma v noise =4.95vrms v out =1.0v c bc =1f c out =1f i out =50ma v noise =4.86vrms i out =5ma v noise =4.88vrms v out =1.0v i out =0.5a c out =1f c bc =0.1f v noise =7.69vrms c bc =1 f v noise =4.95vrms c bc =10 f v noise =4.72vrms v out =4.5v v noise =8.40vrms i out =0.5a c bc =1f c out =1f v out =3.3v v noise =6.86vrms v out =1.0v v noise =4.95vrms downloaded from: http:///
7/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX figure 9 . load regulation figure 10 . v in vs v out figure 11 . i cc vs v in figure 12 . stand by current vs v in 0.980 0.985 0.990 0.995 1.000 1.005 1.010 1.015 1.020 0 100 200 300 400 500 v out [v] output current:i out [ma] 0 1 2 3 4 0 1 2 3 4 5 6 7 v out [v] input voltage:v in [v] v out =3.3v i out =0.5a 0.0 0.5 1.0 1.5 2.0 0 1 2 3 4 5 6 7 i cc [ma] input voltage:v in [v] i out =0.0a 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 7 i st [ a] input voltage:v in [v] i out =0.0a downloaded from: http:///
8/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX figure 13 . output voltage vs output current figure 14. output voltage vs temperature figure 15 . power-supply rejection ratio vs i out figure 16 . power-supply rejection ratio vs v do 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 200 400 600 800 1,000 v out [v] output current:i out [ma] 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m psrr [db] frequency [hz] 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m psrr [db] frequency [hz] i out =500ma i out =50ma i out =5ma i out = 0a c out =47f v out =3.3v i out =500ma c out =47f v do =1.0v v do =0.7v v do =0.5v v do =0.3v 0.980 0.985 0.990 0.995 1.000 1.005 1.010 1.015 1.020 - 60 - 40 - 20 0 20 40 60 80 100 v out [v] temperature [c] downloaded from: http:///
9/ 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX figure 17 . power-supply rejection ratio vs v do figure 18 . power-supply rejection ratio vs v out figure 19 . power-supply rejection ratio vs c bc figure 20 . soft start 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m psrr [db] frequency [hz] 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m psrr [db] frequency [hz] v out =3.3v i out =50ma c out =47f v do =1.0v v do =0.7v v do =0.5v v do =0.3v 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m psrr [db] frequency [hz] i out =500ma c out =47f v out =1.0v v out =3.3v v out =4.5v en: 2v/div v out : 200mv/div c bc = 10 f i out =500ma c out =47f c bc =1f c bc =0.1f downloaded from: http:///
10 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX figure 21 . line transient figure 22 . line transient (i out =500ma slew rate=1v/s) (i out =500ma slew rate=0.2v/s) figure 21 . load transient (i out =0ma to 500ma) v in : 2v/div v out : 10mv/div (ac) v in : 2v/div v out : 10mv/div (ac) i out : 200ma/div v out : 50mv/div (ac) downloaded from: http:///
11 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX 1. application examples vin en bas bao gnd bc vo c in 1f c bc 1f c out 1f v out =1.0v vs v in =2.7v ?gHO? ?u?^?Q? parts maker value parts c in murata 1f gcm188r71e105ka49 c o ut murata 1f gcm188r71e105ka49 c bc murata 1f gcm188r71e105ka49 figure 24. application circuit 1 (v out =1.0v) vin en bas bao gnd bc vo r 1 120k r 2 51k vs c in 1f c out 1f c bc 1f v in =5.0v v out =3.35v ?gHO? ?u?^?Q? parts maker value part number r 1 rohm 120 k mcr03ezpd r 2 rohm 51 k mcr03ezpd c in murata 1f gcm188r71e105ka49 c o ut murata 1f gcm188r71e105ka49 c bc murata 1f gcm188r71e105ka49 figure 25. application circuit 2 (v out =3.35v ) (note) this application example is just one case. actual setting will be decided after a thorough evaluation and verification. (note) this application example is just one case. actual setting will be decided after a thorough evaluation and verification. downloaded from: http:///
12 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX 2. selection of components externally connected vin en bas bao gnd bc vo c in c bc c out v out r 1 r 2 vs v in figure 26 . external components connection (1) output voltage setting to set output voltage, connect resistance of r 1 between bao-bas and connect resistance of r 2 in between bas -gnd. the value of r 1 and r 2 is set that r 1 + r 2 becomes more than 100k. in addition, the resistance for voltage setting is recommended the one that is less than 1% accuracy. in the case of 1v setting, please short bas with bao. [ ] v r r + r v = v 2 2 1 bas out v bas = 1.0v (typ) (2) output capacitor c o ut output capacitor should be selected more than 0. 22 f consider ing about the voltage modulation, thermal characteristics, and distribution of the value. installation of capacitor in the position near the pin in between output terminal and gnd is recommended. in addition, the rated vo ltage of condenser shall be set with enough margin with respect to output voltage of rated voltage of condenser. (3) input capacitor c in installation of input capacitor in the position close to th e pin in between input terminal and gnd is recommended also. the capacitor between input terminal and gnd takes effect w hen power supply impedance increases. (4) filter capacitor c bc filter capacitor c bc and built-in resistance formed a low pass filter that reduces the noise that appears in output voltage. in addition, the filter capacitor c bc also has a soft start function because it limits the rush current of output when it starts. by changing this capacitance value, the rising spee d during start up can be changed. the soft start time with 1v setting of v out and 1f of c bc is 9ms (typ). select the capacity of 0.01f to 10f as an aim . recommended value is 1f. downloaded from: http:///
13 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX i/o equivalen ce circuits vin (pin 8) / vo (pin 1) en (pin 5) bao (pin 6) vin (pin 8) vo (pin 1) en (pin 5) vin vin bao (pin 6) vin bas (pin 7) bc (pin 4) vs (pin 2) vin bas (pin 7) bc (pin 4) vin vin vs (pin 2) vin figure 27. i/o equivalence circuits pcb layout examp le top bottom (board size 60mm x 60mm, board thickness 16mm, material fr - 4) figure 28. circuit diagram of evaluation board (note) this pcb layout example includes the test pattern also. this ic position is u1. downloaded from: http:///
14 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage th e ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply an d the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of th e application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground trace s of external components do not cause variations on the ground voltage. the ground lines must be as short and thick a s possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxim um rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board . in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible tha t the internal logic may be unstable and inrush current m ay flow instantaneously due to the internal powering sequence an d delays, especially if the ic has more than one power sup ply. therefore, give special consideration to power coupling cap acitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field op erating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capac itor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after ea ch process or step. the ics power supply should always be turned off completely before connecting or remo ving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) a nd unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the ele ctric field from the outside can easily charge it. the sm all charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified , unused input terminals should be connected to the power supply or ground line. downloaded from: http:///
15 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX operational notes C continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diod e. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. t he operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical d amage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd volta ge to an input pin (and thus to the p substrate) should be avoided. figure 29. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric c onstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, an d power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that prevents he at damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceede d for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operatio n. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for an y purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic has a built-in over current protection circuit that a ctivates when the output is accidentally shorted. however, i t is strongly advised not to subject the ic to prolonged shorting of the output. 17. light disturbance in a device where a portion of silicon is exposed to light such as in a wl-csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
16 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX ordering information b d 3 7 2 0 1 n u x - t r part number package nux : vson008x2030 packaging and forming specification tr : embossed tape and reel (vson008x2030) marking diagram part number marking package orderable part number d37201 vson008x2030 BD37201NUX- tr vson008x2030 (top view) 201 part number marking lot number 1pin mark d 3 7 downloaded from: http:///
17 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX physical dimension tape and reel information package name vson008x2030 downloaded from: http:///
18 / 18 tsz02201-0v3v0a600100-1-2 ? 2016 rohm co., ltd. all rights reserved. 18. ap r.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD37201NUX revision history date revision changes 18.apr.2016 001 new release downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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